CLP Engineering Studies Award (Hong Kong)

As an awardee, you will receive a cash award of HK$50,000, mentorship from industry professionals, internship opportunities and career opportunities.

About this award

The CLP Engineering Studies Award (ESA) sponsors talented engineering students in their final year of university. 

Selected students may join our Graduate Trainee programme to gain valuable work experience. 

Who should apply

To apply for this award, you must:

  • Be a full-time undergraduate;
  • Pursue your final year in the Academic Year 24/25 (Graduate in 2025);
  • Major in Electrical / Mechanical / Electronic Engineering
  • Have good academic results and a genuine passion for engineering; and
  • Have the right to live and work in Hong Kong.

How to apply

The award is now open for enrolment! Please apply online by 13 June 2024. You do not need to provide any cover letters, references or certificates at this stage. You will be asked to provide true copies at a later stage.

More information

If you have any questions, you may contact [email protected].

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